基板処理装置

Substrate processing device

Abstract

PROBLEM TO BE SOLVED: To enhance the cooling effect without increasing the usage of a cooling medium of a semiconductor manufacturing apparatus.SOLUTION: A substrate processing device has a processing chamber processing substrates, a heating section heating the interior of the processing chamber, at least one cooling section provided outside the processing chamber and cooling the processing chamber and devices located outside the processing chamber, and a heat transfer part transferring heat of a coolant to be supplied to the cooling section to the coolant discharged from the cooling section.
【課題】半導体製造装置の冷却媒体の使用量を増加させずに冷却効果を高める。 【解決手段】基板を処理する処理室と、処理室内を加熱する加熱部と、処理室外に設けられ、処理室と処理室外の機器とを冷却する少なくとも1つ以上設けられた冷却部と、冷却部に供給される冷媒の熱を、冷却部から排出される冷媒へ熱移動させる熱移動部と、を有する。 【選択図】図1

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