一种集成电路芯片热沉材料

Heat sink material for integrated circuit chip

  • Inventors: LIU NANLIN
  • Assignees: 刘南林
  • Publication Date: January 20, 2016
  • Publication Number: CN-105253881-A

Abstract

DLC集成电路芯片热沉材料是采用类金刚石粉压制成型技术方案制造的。这种热沉材料具有接近金刚石的导热性能,能够避免集成电路在超高速运算状态下因过热而损毁。从而有助于解决进一步提高集成电路运算速度必须面对的安全稳定运行问题,适用于智能手机、笔记本电脑、大型计算机制造行业。该技术属于功能新材料应用领域。
The invention provides a diamond-like carbon (DLC) heat sink material for integrated circuit chip. The DLC heat sink material is prepared by compression molding of DLC powder, has heat conduction performance close to that of diamond and can prevent damage of an integrated circuit in a superspeed computation state due to overheat; thus, the DLC heat sink material is favorable for overcoming the problem of safe and stable operation in further improvement of the computation speed of the integrated circuit and applicable to the industry of manufacturing of smartphones, laptops and large computers. The DLC heat sink material belongs to the field of application of novel functional materials.

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